发明名称 Substrate treatment method and substrate treatment apparatus
摘要 The present invention is a substrate treatment method in which a treatment by supplying a treatment solution from a nozzle to a substrate is successively performed for a plurality of substrates, which comprises the step of, during the performance of the successive treatments, performing between the treatments a plurality of pre-dispenses for different purposes of the treatment solution, wherein at least a recipe of the treatment solution to be pre-dispensed or a start condition of the pre-dispense is determined for each of the pre-dispenses. According to the present invention, the pre-dispense can be performed at a necessary and sufficient frequency to shorten the suspension time due to the pre-dispenses in the substrate treatment. This improves the throughput and reduces the number of pre-dispenses, resulting in reduced consumption of the treatment solution.
申请公布号 US2005260333(A1) 申请公布日期 2005.11.24
申请号 US20050188890 申请日期 2005.07.26
申请人 TOKYO ELECTRON LIMITED 发明人 MIYATA AKIRA
分类号 H01L21/00;(IPC1-7):B05D1/02;B05D3/12 主分类号 H01L21/00
代理机构 代理人
主权项
地址