| 摘要 |
The invention relates to methods for material laser cutting, mainly expensive materials and can be used for different techniques, for example in the jewellery industry for cutting diamond crystals prior to the faceting thereof. The inventive laser material processing (cutting) method consists in ablating material from a cut area by means of a laser beam (5, 6) which is focused by at least one objective lens (1, 2). Said cut is formed simultaneously on both sides of a billet (9) by means of two axial oppositely oriented laser beams (5, 6), wherein previously received information about the profiles of the billet (9) surface sections (7, 8) on each cut sides along the entire length thereof is used, thereby making it possible to adjust the focuses of the laser objective lenses (1, 2) on the corresponding sections of the processable surfaces (7, 8). In addition, the reciprocal isolation of laser channels (13, 14) is carried out during processing by means of a polarisation method in order to prevent the destruction of optical system elements by return radiation (15, 16). For this purpose, the processing is carried out by the left-circular polarisation laser beam (5) on one side of the cut and by the right-circular polarisation laser beam (6) on the other side.
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