| 发明名称 |
Substrate, semiconductor device, and substrate fabricating method |
| 摘要 |
A substrate is disclosed that includes an inductor that is realized by first wiring, and resin including high magnetic permeability filler material that covers the first wiring.
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| 申请公布号 |
US2005258509(A1) |
申请公布日期 |
2005.11.24 |
| 申请号 |
US20050132062 |
申请日期 |
2005.05.18 |
| 申请人 |
HORIKAWA YASUYOSHI;SHIMIZU NORIYOSHI |
发明人 |
HORIKAWA YASUYOSHI;SHIMIZU NORIYOSHI |
| 分类号 |
H05K1/16;H01F17/00;H01F17/04;H01F41/04;H01L21/56;H01L23/12;H01L23/498;H01L25/16;H01L29/00;H05K3/28;H05K3/46;(IPC1-7):H01L29/00 |
主分类号 |
H05K1/16 |
| 代理机构 |
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