Singulation of individual electronic packages fabricated as part of a common matrix, is accomplished by mask patterning and chemical exposure in combination with physical sawing. In one embodiment of a singulation process in accordance with the present invention, an initial, shallow saw cut into inter-package regions of the matrix exposes underlying metal to subsequent chemical etching steps. In an alternative embodiment, a separate photoresist mask may be patterned over the matrix to selectively expose metal in inter-package regions to chemical etching.
申请公布号
WO2005112102(A2)
申请公布日期
2005.11.24
申请号
WO2005US16482
申请日期
2005.05.10
申请人
GEM SERVICES, INC.;YILMAZ, HAMZA;CHIA, ANTHONY;ZENG, XIAOGUANG;WONG, HIE MING;WANG, LIMING;ZHANG, YIJU
发明人
YILMAZ, HAMZA;CHIA, ANTHONY;ZENG, XIAOGUANG;WONG, HIE MING;WANG, LIMING;ZHANG, YIJU