| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing a semiconductor excellent in fillability and void resistance, for example, in a flip chip package and capable of suppressing generation of warpage. SOLUTION: The epoxy resin composition for sealing a semiconductor comprises (A) an epoxy resin represented by general formula (1), (B) a phenol resin, (C) a hardening accelerator, and (D) a spherical inorganic filler which contains particles having a particle size of 45μm or more in an amount of 0.3 wt% or less, has an average particle size of 15μm or less and is surface-treated with a silane coupling agent having an acrylic group or a methacrylic group. COPYRIGHT: (C)2006,JPO&NCIPI
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