PRESSURE-SENSITIVE ADHESIVE SHEET FOR BOTH DICING AND DIE-BONDING, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME

摘要

PROBLEM TO BE SOLVED: To reduce damages to bonding wires which occur at stacking of semiconductor chips and to eliminate variations in the heights of semiconductor devices due to the lack of accuracy of the thickness of adhesive layers for bonding the semiconductor chips to each other, the variation in heights from a substrate to the surface of the semiconductor chip in the most upper layer, the tilt of the semiconductor chip in the uppermost layer, etc. in the so-called "stacked type semiconductor device".

SOLUTION: A pressure-sensitive adhesive sheet for both dicing and die-bonding consists of the substrate and a pressure sensitive adhesive layer which is stacked separably on top of the substrate. The pressure-sensitive adhesive layer has a pressure-sensitive adhesiveness at room temperature and thermosetting properties. It has an elastic modulus of 1.0×103-1.0×104Pa before heat curing and a melt viscosity of 100-200 Pa sec at 120°C prior to heat curing. When the pressure-sensitive adhesive layer is kept at a fixed temperature of 120°C prior to heat curing, a time of 60 sec or shorter is required before the melt viscosity reaches a minimum value.

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