POLYIMIDE COMPOSITION HAVING WATER SORPTION RESISTANCE, AND METHOD RELATED TO THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a polyimide composition having water sorption resistance and related methods.

SOLUTION: A water absorption resistant polyimide paste (or solution) is particularly useful to make a paste for screen printing of electronic equipment and to make electronic parts made of the paste. A group of soluble polyimides and their solvents were discovered to be particularly resistant to moisture absorption. These polyimide solutions contain if necessary polyimides containing cross-linking monomers and/or also thermal crosslinking agents. In addition, these polyimide pastes may optionally contain adhesion promoting agents, blocked isocyanates, metals, metal oxides, and other inorganic fillers. The polyimide paste (or solution) comprises a polyimide having a glass transition temperature higher than 250°C and have a water absorption factor of less than 2% and a positive value of measured solubility.

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