| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor inspection device and the probe method of semiconductor inspection for reducing recognition errors, without requiring provision of special recognition patterns, and for realizing high precision positioning. SOLUTION: In this semiconductor inspecting device and the probe method of semiconductor inspection, a probe card is provided with a reference probe PCB which is not brought into contact with a semiconductor element as well as a probe PCA for measurement, and the positioning of the probe card is operated, by using a recognition mark corresponding to the reference probe PCB arranged in the semiconductor element and the reference probe PCB. Thus, the probe for measurement can be surely connected to a pad at the inspecting of the semiconductor element, recognition errors can be reduced without using special recognition patterns, and the high precision positioning of the probe card can be attained. COPYRIGHT: (C)2006,JPO&NCIPI
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