| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a manufacturing method of an optically coupled semiconductor device that can be applied to a plurality of pitches between terminals. <P>SOLUTION: A plurality of pairs of luminous element side mounting terminals 1 and luminous element side lead connection thermals 2 are formed outside an outer package 9 by differentiating terminal distances so as to conform to a plurality of kinds of defined terminal distances. A plurality of pairs of light receiving element side mounting terminals 3 and light receiving element side wire connection terminals 4 are formed outside the outer package 9 by differentiating terminal distances so as to conform to a plurality of kinds of defined terminal distances. The terminals or tie bars 16 are selectively cut off in process after a tie bar cutting process, thereby to form the terminals having predetermined defined terminal distances from a plurality of kinds of the defined terminal distances. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
