发明名称 |
PART PUSH-UP APPARATUS AND METHOD, AND PART MOUNTING UNIT |
摘要 |
PROBLEM TO BE SOLVED: To provide a method for delaminating a semiconductor chip from a wafer sheet in a reliable way without faulty delamination or damage. SOLUTION: The part push-up unit 20 has a plurality of push-up pins 56 whose base sides are fixed to a common pin fixing section 87, and the pins 56 include at least one set different from the rest in terms of the tip position H in the vertical direction. It also has an elevating mechanism 95 for raising and lowering the pin fixing section 87. COPYRIGHT: (C)2006,JPO&NCIPI |
申请公布号 |
JP2005327970(A) |
申请公布日期 |
2005.11.24 |
申请号 |
JP20040146072 |
申请日期 |
2004.05.17 |
申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
NARITA MASACHIKA;SHIDA SATOSHI |
分类号 |
H01L21/67;H01L21/301;H01L21/52;H01L21/68;(IPC1-7):H01L21/52 |
主分类号 |
H01L21/67 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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