| 摘要 |
PROBLEM TO BE SOLVED: To provide a connection structure of a semiconductor chip to a wiring substrate capable of obtaining connection reliability, even when the semiconductor chip is thin in thickness, and a wiring substrate used for the structure. SOLUTION: A connection structure of a semiconductor chip, in which a semiconductor chip and a wiring substrate having an electrode in opposition thereto are connected by adhesive, capable of maintaining electrical connections, while deformation is in such an extent that the radius of a round bar is 40 mm or less, when the substrate is bent with the round bar which is an axis. It is preferable that the semiconductor chip have a plurality of electrodes on the periphery thereof and the thickness be 0.3 mm or less. Further, it is preferable that the semiconductor chip and/or the electrode of the wiring substrate protrude from an insulating surface and a dummy electrode, having substantially the same height as that of the protruded electrode, be provided at least in a region enclosed by the peripheral electrode of the semiconductor chip after connection. COPYRIGHT: (C)2006,JPO&NCIPI |
