发明名称 |
Method and apparatus for ultrasonic scanning of a fabrication wafer |
摘要 |
A method and apparatus for ultrasonic scanning of a wafer assembly is disclosed. The wafer assembly is held in a wafer chuck and rotated. A transducer generates ultrasound in the wafer assembly and the ultrasound emitted from the wafer assembly is sensed. A controller adjusts the relative positions of the wafer and the transducer and controls the transducer to generate ultrasound at a number of scan points.
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申请公布号 |
US2005257617(A1) |
申请公布日期 |
2005.11.24 |
申请号 |
US20040852521 |
申请日期 |
2004.05.24 |
申请人 |
BUSCH RALPH E;KRAUSMAN DENNIS |
发明人 |
BUSCH RALPH E.;KRAUSMAN DENNIS |
分类号 |
A61B8/14;H01L21/00;(IPC1-7):A61B8/14 |
主分类号 |
A61B8/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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