| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a lithography apparatus in which heat adjustment on a wafer is improved. <P>SOLUTION: The lithography device comprises a lighting system which supplies projection beams, a structure for supporting a pattern forming unit which structure is so constructed that the pattern forming device gives the section of a beam a pattern, a substrate table which retains a substrate, a projection system which projects a patterned beam onto target portions on the substrate, and an adjustment system which adjusts the substrate. The adjusting system adjusts nontarget portions on the substrate using an adjustment fluid. A device manufacturing method, using the lithography device, includes a step of adjusting the nontarget portions on the substrate. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
