| 摘要 |
PROBLEM TO BE SOLVED: To provide a pressure-sensitive adhesive composition and a pressure-sensitive adhesive sheet which does not cause the problems that when a semiconductor material is tacked to the adhesive sheet and diced into chips, it does not inordinately scatter the semiconductor material debris, does not cause scraping up of the adhesive and when it pick up the chiped semiconductor material after dicing, it does not generate static. SOLUTION: The pressure-sensitive adhesive composition contains 100 mass pts. elastomer and 0.1-30 mass pts. (meth)acrylate-amine copolymer. The elastomer is a copolymer copolymerized with at least one kind of halogen-containing monomer. The mass% of 0.1-55 of the elastomer is the halogen-containing monomer. The (meth)acrylate-amine copolymer is obtained by copolymerizing a (meth)acrylate monomer and an amine-containing monomer. The mass% of 0.1-30 of the (meth)acrylate-amine copolymer is the amine-containing monomer. COPYRIGHT: (C)2006,JPO&NCIPI |
