发明名称 PROCESSING DEVICE FOR PLATE-LIKE ELECTRODE
摘要 PROBLEM TO BE SOLVED: To provide a processing device capable of easily aligning heights of a plurality of electrodes formed to protrude from the surface of a platelike object without short-circuiting, and preventing the deposition of cut chips to the plate-like object and the contamination in a processed region. SOLUTION: The processing device for aligning the heights of the plurality of electrodes formed to protrude from the surface of the plate-like object includes a chucking table having a mount face for mounting the plate-like object, a cutting unit provided in a machining region and having a cutting tool for cutting the plurality of electrodes formed to protrude from the surface of the plate-like object held on the chuck table to align their heights, an air-jetting means for jetting the air onto the machined surface of the plate-like object held on the chuck table to blow off the cut chips on the machined surface, and a suction means for sucking the cut chips blown off by the air jetted from the air-jetting means. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005327838(A) 申请公布日期 2005.11.24
申请号 JP20040143198 申请日期 2004.05.13
申请人 DISCO ABRASIVE SYST LTD 发明人 MORI TAKASHI;NAMIOKA SHINICHI;MATSUTANI KAZUHIRO
分类号 H01L21/60;(IPC1-7):H01L21/60 主分类号 H01L21/60
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