| 摘要 |
The high-frequency circuit cooling apparatus comprises a package container 14 for housing a high-frequency circuit, a tank 16 for storing a gas to be introduced into the package container 14 , a cold head 12 for cooling the package container 14 and the tank 16 , pipes 24, 26 connected to the tank 16 , for supplying the gas into the tank 16 , pipes 18, 22 detachably connected between the tank 16 and the package container 14 , for introducing the gas in the tank 16 into the package container 14 , and pipes 34, 36 detachably connected to the package container 14 , for discharging the gas in the package container 14.
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