| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wiring board which enables various devices, such as semiconductor devices or the like, to be high densely mounted thereon, facilitates higher speed, higher density and finer wiring, and has excellent reliability; and to provide a semiconductor package using the same. <P>SOLUTION: A base dielectric 7 is provided on the wiring board 13. The base dielectric has a film thickness of 20 to 100 μm. A reinforcing fiber comprising glass or aramid is contained in a heat resistant resin that has glass transition temperature of 150°C or over. Moreover, the wiring board has physical properties as follows: (1) assuming that modulus of elasticity is D<SB>T</SB>when thermal expansion ratio in the thickness direction is 90 ppm/K or below and when temperature is T°C, and breaking strength is H<SB>T</SB>when temperature is TC, then (2) D<SB>23</SB>≥5 GPa, (3) D<SB>150</SB>≥2.5 GPa, (4) (D<SB>-65</SB>/D<SB>150</SB>)≤3.0, (5) H<SB>23</SB>≥140 MPa, and (6) (H<SB>-65</SB>/H<SB>150</SB>)≤2.3. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
