| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device capable of reducing waveform distortion caused by the reflection of a high-speed signal assigned to the innermost ball pad of a BGA or CSP package from a long plating stub on an interposer. <P>SOLUTION: In an interposer substrate 1 for a multi-terminal semiconductor element 10 represented by a BGA which transmits a high-speed differential signal, the high-speed differential signal is assigned to an innermost part adjacent ball pad 8. The high-speed differential signal is connected to an outermost ball pad 18 again. The signal connected to the innermost ball pad 8 is transmitted as a main line. The signal connected to the outermost part adjacent ball pad 18 is terminated on a mother board by a terminal resistor 20 matched with the characteristic impedance of a signal interconnection 14 connecting between the innermost ball pad 8 and the outermost ball pad 18, to reduce the influence of the plating stub 6 to a waveform. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
