SUPPORT FOR HEAT TREATMENT OF SEMICONDUCTOR WAFER

摘要

PROBLEM TO BE SOLVED: To provide a support for heat treatment of a semiconductor wafer ensuring high temperature heat treatment while eliminating slip due to thermal deformation of the support. SOLUTION: The support for heat treatment of a semiconductor wafer comprises a thin plate of silicon and has a silicon island formed on the contact surface with the semiconductor wafer wherein the silicon island has a width of 50-1,000μm and a depth of 10-50μm. COPYRIGHT: (C)2006,JPO&NCIPI