发明名称 |
Multichip package test |
摘要 |
A test apparatus for testing a multi-chip package comprising a multiplicity of semiconductor chips, which includes a test driver having one drive channel and at least one input/output channel. A test board is mounted with the multi-chip package. Drive pins of the semiconductor chips are parallel connected to the drive channel, and input/output pins of the semiconductor chips are parallel connected to the input/output channel.
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申请公布号 |
US2005258858(A1) |
申请公布日期 |
2005.11.24 |
申请号 |
US20050191494 |
申请日期 |
2005.07.27 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
SHIN YOUNG-GU;HEO KYOUNG-IL;LEE HYOUNG-YOUNG;KWON HYUK;JU KI-BONG;BANG JEONG-HO;SHIM HYUN-SEOP |
分类号 |
G01R31/28;G01R31/3185;(IPC1-7):G01R31/26 |
主分类号 |
G01R31/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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