Treating a semiconductor wafer comprises using a system held by rollers which hold the wafer in a region of their edges so that an etching medium flows against the edge of the wafer

摘要

Treating a semiconductor wafer comprises using a system held by rollers which hold the wafer in a region of their edges so that an etching medium flows against the edge of the wafer. A shaft is connected to one end of the rollers and both ends of the shaft are spaced at 2 cm from each other. An independent claim is also included for a device for treating a semiconductor wafer comprising a system of rollers and a protective screen placed in front of the edge of the wafer.