发明名称 |
METHOD AND APPARATUS FOR COUPLING MELT CONDUITS IN A MOLDING SYSTEM AND/OR A RUNNER SYSTEM |
摘要 |
<p>Method and apparatus for a molding melt conduit and/or runner system includes coupling structure having a first surface configured to couple with a first melt conduit or manifold, and a second surface configured to couple with a second melt conduit or manifold. Cooling structure is configured to provide a coolant to the coupling structure. Preferably, the cooling structure cools the coupling structure to a temperature that causes any melt leaking from near the coupling structure to at least partially solidify thereby further sealing the connection(s).</p> |
申请公布号 |
WO2005110704(A1) |
申请公布日期 |
2005.11.24 |
申请号 |
WO2005CA00556 |
申请日期 |
2005.04.14 |
申请人 |
HUSKY INJECTION MOLDING SYSTEMS LTD. |
发明人 |
MANDA, JAN M.;GLASFORD, ZAC;KESTLE, MARTIN R. |
分类号 |
B22D17/20;B29C45/03;B29C45/17;B29C45/20;B29C45/26;B29C45/27;(IPC1-7):B29C45/17 |
主分类号 |
B22D17/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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