发明名称 METHOD AND APPARATUS FOR COUPLING MELT CONDUITS IN A MOLDING SYSTEM AND/OR A RUNNER SYSTEM
摘要 <p>Method and apparatus for a molding melt conduit and/or runner system includes coupling structure having a first surface configured to couple with a first melt conduit or manifold, and a second surface configured to couple with a second melt conduit or manifold. Cooling structure is configured to provide a coolant to the coupling structure. Preferably, the cooling structure cools the coupling structure to a temperature that causes any melt leaking from near the coupling structure to at least partially solidify thereby further sealing the connection(s).</p>
申请公布号 WO2005110704(A1) 申请公布日期 2005.11.24
申请号 WO2005CA00556 申请日期 2005.04.14
申请人 HUSKY INJECTION MOLDING SYSTEMS LTD. 发明人 MANDA, JAN M.;GLASFORD, ZAC;KESTLE, MARTIN R.
分类号 B22D17/20;B29C45/03;B29C45/17;B29C45/20;B29C45/26;B29C45/27;(IPC1-7):B29C45/17 主分类号 B22D17/20
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