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发明名称
APPARATUS FOR CONTROLING ETCHING AREA AND APPARATUS AND METHOD FOR ETCHING EDGE OF WAFER
摘要
申请公布号
KR100532354(B1)
申请公布日期
2005.11.24
申请号
KR20040038891
申请日期
2004.05.31
申请人
SAMSUNG ELECTRONICS CO., LTD.
发明人
PARK, JONG CHUL;JEONG, SANG SUP
分类号
H01L21/3065;G01L21/30;H01J37/32;H01L21/00;H01L21/02;(IPC1-7):H01L21/306
主分类号
H01L21/3065
代理机构
代理人
主权项
地址
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