发明名称 |
PACKAGING FORM FOR ELECTRONIC COMPONENT AND ITS SHIPPING METHOD |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a packaging form for electronic components capable of simplifying an inventory control and reducing the number of electronic components becoming useless state at the time of manufacturing an electronic equipment. <P>SOLUTION: A tape-like packaging member 6 comprises a plurality of bags 1 to 5 composed of a flexible film of synthetic resin and the like connected in series in one direction. A plurality of kinds of electronic component parts A to B used for advancing the mounting process of manufacturing a specific electronic instrument are classified according to the kinds and held by one packaging member 6 under a state in which the electronic component parts are stored in each of the bags 1 to 5. The number of electronic component parts A to E for each of the kinds held in one packaging member is set to be equal to the number of each of the kinds of electronic components to be prepared for advancing the mounting process of manufacturing the predetermined lot size on the basis of a production plan at a certain date. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
申请公布号 |
JP2005324839(A) |
申请公布日期 |
2005.11.24 |
申请号 |
JP20040145975 |
申请日期 |
2004.05.17 |
申请人 |
MURATA MFG CO LTD |
发明人 |
FUKUDA KENICHI;IWASA MITSUGI |
分类号 |
B65D30/10;B65D33/38;B65D75/42;B65D85/86;H05K13/02 |
主分类号 |
B65D30/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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