| 摘要 |
PROBLEM TO BE SOLVED: To provide a press sensor capable of packaging electronic components integrally at low costs. SOLUTION: A substrate sheet 20A has upper and lower sheets 21, 22, and is formed by separating the upper sheet 21 from the lower one 22. Counter electrodes are provided on the upper and lower sheets 21, 22 each. The upper sheet 21 can be formed as a sheet where an electrode is printed and formed on a base. The lower sheet 22 can be formed as a sheet where the electrode and wiring are formed in the base by metal foil. Only the lower sheet 22 can be formed by a flexible printed circuit board where the electrode and the wiring are formed in the base by the metal foil, thus suppressing manufacturing costs even if an expansion region expanded from the side of the upper sheet 21 is provided on the lower sheet 22 and the electronic component is packaged in the expansion region. COPYRIGHT: (C)2006,JPO&NCIPI
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