| 摘要 |
PROBLEM TO BE SOLVED: To provide a new epoxy resin composition for sealing optical semiconductors, giving cured products having colorless transparency, furthermore rapidly curable and using a non-halogen curing accelerator, and to provide optical semiconductor-sealed products having the cured product of the composition. SOLUTION: The epoxy resin composition comprises an epoxy resin (A), an acid anhydride curing agent (B) and a curing accelerator (C) as essential ingredients, wherein a tetraalkyl phosphonium carboxylate of formula (1), preferably, tetra-n-butyl phosphonium acetate is contained in the rapidly curable epoxy resin composition as the ingredient (C). The optical semiconductor-sealed products contain the composition. (Wherein, R<SP>1</SP>is a 2-4C alkyl; and R<SP>2</SP>is a 1-4C alkyl). COPYRIGHT: (C)2006,JPO&NCIPI
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