发明名称 |
Method of cutting glass substrate material |
摘要 |
There is provided a method for cutting a glass substrate member capable of cutting the glass substrate member while forming a scribe line with a "scriber" and also obtaining a high-quality and hard-to-chip cutting plane. The cutting method for the glass substrate member according to the present invention comprises a removing step for removing a part or whole of a back surface portion of the glass substrate member; and a scribing step for forming a scribe line that produces a crack on a front surface of the glass substrate member. The crack extends to a back surface of the glass substrate member.
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申请公布号 |
US2005258135(A1) |
申请公布日期 |
2005.11.24 |
申请号 |
US20040519256 |
申请日期 |
2004.12.27 |
申请人 |
ISHIKAWA HIROKAZA;HAYASHI TOSHIO |
发明人 |
ISHIKAWA HIROKAZA;HAYASHI TOSHIO |
分类号 |
G02F1/1333;C03B33/023;C03B33/037;C03B33/04;C03B33/07;C03C15/00;G09F9/30;H01L51/50;H05B33/02;(IPC1-7):B29D11/00 |
主分类号 |
G02F1/1333 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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