Molding apparatus for micro-components has molding chamber in which particles are sintered by laser, external acousto-optical modulator below laser controlling beam so that it operates in pulsed or continuous wave mode

摘要

Molding apparatus for micro-components (3) has a molding chamber in which particles (4) are sintered or melted by a laser (5). An external acousto-optical modulator (7a, 7b) is mounted below the laser and controls the beam so that it operates in a pulsed or continuous wave mode. Two or more annular rakes mounted on a common drive feed the molding chamber with powder. An independent claim is included for use of a laser fitted with a beam splitter (6) or combiner and a modulator in production of micro-components.