| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device capable of preventing the generation of short-circuit of the wire of a bonding wire made to flow by the pouring pressure of sealing material, such as resin or the like in a manufacturing process, after wire bonding or a sealing process. <P>SOLUTION: Insulating particles 7 are atomized and adhered to the bonding wires 3, respectively connecting bonding pads, selected from a plurality of bonding pads for a semiconductor chip 1 to a lead 2, and the particles 7 are cured thereafter to constitute the bonding wire 3 so that the surface thereof is coated by the adhered insulating particles 7. According to this constitution, the bonding wire 3 can be fixed so as to be unlikely to flow, by the pouring pressure of the sealing material 4 in the sealing process of the sealing material 4 which is the manufacturing process after wire bonding; and even if the bonding wire 3 is made to flow, short-circuiting of the wire can be prevented, whereby a semiconductor device of superior quality can be provided. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
