| 摘要 |
PROBLEM TO BE SOLVED: To provide a device and a method of assisting the detachment of a semiconductor chip from an adhesive tape on which the chip is loaded. SOLUTION: The detachment device is provided with a substrate 12 suited to contact the adhesive tape at the position of the chip, and a retaining force generator 10 connected to the substrate 12 to pull the adhesive tape in a direction of drawing away from the chip. A lifting device 20 is provided protrusively from the substrate 12, may be moved in a lateral direction traversing the surface of the substrate 12, and may be also moved in the vertical directions to lift the chip. The propagation of a control lifting the chip and peeling-off between the chip and the adhesive tape are achieved, by moving the device 20 over the entire width of the chip, when the chip is to be lifted. COPYRIGHT: (C)2006,JPO&NCIPI |
