SOCKET FOR SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To achieve both of an increase in a contact area between a heat sink and an outer peripheral surface of a semiconductor device and a reduction in size of a socket for a semiconductor device. SOLUTION: When tips of latch members 18A and 18B are brought away from each other and a part above an arrangement plate/positioning member 24 is thereby opened, a pressing part 12PU of a heat sink member 12 comes in contact with the outer peripheral surface of the semiconductor device 22. COPYRIGHT: (C)2006,JPO&NCIPI