DEFECT DETECTOR, WIRING AREA EXTRACTOR, DEFECT DETECTION METHOD, AND WIRING AREA EXTRACTING METHOD

摘要

PROBLEM TO BE SOLVED: To easily extract a wiring area in an image on a substrate and to thereby appropriately detect a defect in a pattern formed on the substrate.

SOLUTION: As to a reference binary image showing a pattern including wiring formed on the substrate 9, a contracted image is obtained by performing contraction processing for a marked area having a pixel value equal to a pixel value corresponding to the wiring area, and a contracted/expanded image is obtained by performing expansion processing nearly equal to the contraction processing for the marked area remaining in the contracted image. Subsequently, a difference image between the contracted/expanded image and the binary image is generated as a wiring image showing the wiring area. This makes it possible to easily extract the wiring area that is a minute pattern area. Further, different defect detection sensitivities are set in the wiring area and in the other areas based on the wiring image. The defect in the pattern on the substrate 9 can be appropriately detected by detecting a defect in an image under inspection in accordance with the detection sensitivities.

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