| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor chip comprising two chips, having planar symmetric terminal arrays of common structure, a semiconductor device and their manufacturing method, a circuit board and an electronic apparatus thereof. <P>SOLUTION: The position of a first terminal T<SB>1</SB>of a first semiconductor chip 100 is plane symmetric, with respect to the position of the second terminal T<SB>2</SB>of a second semiconductor chip 200. First buffer circuits C<SB>1</SB>, C<SB>2</SB>of the first semiconductor chip 100 are identical, at least in design, to the second buffer circuits C<SB>1</SB>, C<SB>2</SB>of the second semiconductor chip 200. First and second internal circuits (a decoder 11, a control circuit 21, and the like) are identical, at least in design. Interconnections 55, 61 are formed into different patterns. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
