| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a high reliability electronic component, by removing insulation defects due to a trimming groove formed by a laser, and to provide a method for manufacturing a non-reciprocal circuit element. SOLUTION: In the method for manufacturing the electronic component, electrodes 225, 226 formed on the surface of one laminated substrate 220 are soldered to electrodes 215, 216 formed on the surface of the other laminated substrate 210, in which capacitive electrodes 211, 212 are built. At first, the capacitive electrode 211 is trimmed by a laser from the surface of the laminated substrate 210. Then a resin film 235 is formed on the surface of the laminated substrate 210, including the trimming groove 217 formed by laser trimming, and solder paste 230 is applied to positions corresponding to the electrodes 215, 216. When the resin film 235 is in a half-cured state, the solder paste 230 reaches at the electrodes 215, 216 through the resin film 235. Then the laminated substrate 220 is superimposed on the laminated substrate 210, and the solder paste 230 is melted and cured and the electrodes 215, 225, 216, 226 are soldered. COPYRIGHT: (C)2006,JPO&NCIPI
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