发明名称 INJECTION MOLD DEVICE AND INJECTION MOLDING METHOD
摘要 PROBLEM TO BE SOLVED: To suppress an increase in cost, enhance dimensional stability and suppress the occurrence of weld flash, while restraining strength from being decreased by a weld line, when a resin molding with a through-hole is injection-molded. SOLUTION: A movable-side mold 20 is equipped with a sleeve pin 23 and a core pin 24, which are slidably arranged in a mold clamping direction A by activation force of an external ejector member 6b. In the cutting operation of operating the ejector member 6b so as to advance from a first position to a second position in a state wherein the mold is clamped, the core pin 24 forms the through-hole 5a of the resin molding 5 by sliding with respect to the sleeve pin 23 so as to cut a resin in a disc gate 4. In the mold release operation of operating the ejector member 6b so as to advance from the second position to a third position in the state wherein the mold is opened, the sleeve pin 23 slides with respect to the movable-side mold 20 so as to release the resin molding 5 from the movable-side mold 20. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005324516(A) 申请公布日期 2005.11.24
申请号 JP20040146589 申请日期 2004.05.17
申请人 AISAN JUSHI KOGYO KK 发明人 NAITO MAKOTO
分类号 B29C45/38;B29C45/17;B29C45/40;(IPC1-7):B29C45/38 主分类号 B29C45/38
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