发明名称 THIN FILM DEVICE, INTEGRATED CIRCUIT, ELECTROOPTIC DEVICE, AND ELECTRONIC DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a thin film device that can secure stable operation by avoiding the influence of the heat generated between thin film elements placed adjoiningly in the laminated direction. <P>SOLUTION: The thin film device (1) includes a plurality of thin film element layers (13, 15) having one or more thin film elements. The thin film element layers (20, 30) have heat generating regions (21, 31) for generating heat when supplied with an electric current, and each of the thin film elements is relatively placed so that the heat generating region (21) of the thin film element (20) included in the one thin film element layer (13) does not overlap with the heat generating region (31) of the thin film element (30) included in the other thin film element layer (15) in a direction of thickness of the thin film element layers. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005328026(A) 申请公布日期 2005.11.24
申请号 JP20050020988 申请日期 2005.01.28
申请人 SEIKO EPSON CORP 发明人 HARA HIROYUKI
分类号 G02F1/1368;H01L21/02;H01L21/20;H01L21/336;H01L21/58;H01L21/60;H01L21/68;H01L21/77;H01L21/822;H01L21/8234;H01L21/84;H01L27/00;H01L27/04;H01L27/08;H01L27/088;H01L27/12;H01L29/04;H01L29/786;H01L31/036;H01L31/20 主分类号 G02F1/1368
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