| 摘要 |
PROBLEM TO BE SOLVED: To provide a simply structured BGA type semiconductor device capable of adequately dissipating heat, and reducing warpage of a substrate irrespective of the substrate size. SOLUTION: The BGA type semiconductor device comprises a semiconductor chip 1; a circuit wiring board 3 having a main surface on which the semiconductor chip 1 is flip chip-mounted by a bump electrode 2, and a rear surface on which a pad for a ball electrode is disposed; a ceiling board 5 for dissipating the heat generated from the semiconductor chip 1; and a frame body 7 formed around the circuit wiring board 3 and ceiling boat 5 to abut them. The frame body 7 is formed such that the distance between the neighborhood to a corner in the semiconductor chip 1 and the inner wall surface 7c of the frame body is shorter than the distance between the neighborhood to the center of a side wall surface in the semiconductor chip 1 and the inner wall surface of the frame body 7. COPYRIGHT: (C)2006,JPO&NCIPI |
