| 摘要 |
An adhesive/spacer structure ( 52, 52 A, 60 ) is used to adhere first and second die ( 14, 18 ) to one another at a chosen separation in a multiple-die semiconductor chip package ( 56 ). The first and second die define a die bonding region ( 38 ) therebetween. The adhesive/spacer structure may comprise a plurality of spaced-apart adhesive/spacer islands ( 52, 52 A) securing the first and second die to one another at a chosen separation ( 53 ). The adhesive/spacer structure may also secure the first and second die to one another to occupy about 1-50% of the die bonding region.
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