发明名称 |
Module for cooling semiconductor device |
摘要 |
A module for cooling a heat generating element comprising a heat receiving plate thermally connected to at least one heat generating element; a heat transfer device one end portion of which is thermally connected to the heat receiving plate and other end portion of which is thermally connected to a heat dissipating plate; a thermoelectric cooler one face of which is thermally connected to one face of the heat dissipating plate; a first heat sink thermally connected to other face of the heat dissipating plate; and a second heat sink thermally connected to other face of said thermoelectric cooler.
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申请公布号 |
US2005257532(A1) |
申请公布日期 |
2005.11.24 |
申请号 |
US20040985412 |
申请日期 |
2004.11.11 |
申请人 |
IKEDA MASAMI;KIMURA YUICHI;NAKAMURA TOSHIAKI;SHIMADA MAMORU |
发明人 |
IKEDA MASAMI;KIMURA YUICHI;NAKAMURA TOSHIAKI;SHIMADA MAMORU |
分类号 |
F25B21/02;F25D23/12;(IPC1-7):F25B21/02 |
主分类号 |
F25B21/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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