Method and system for applying an adhesive substance on an electronic device

摘要

According to one embodiment of the invention, a system for applying an adhesive substance to an electronic device having a region designated to be coupled to another device is provided. The region has a first shape defined by a first boundary. The system includes a tube having an open end. The system also includes a nozzle having an opening coupled to the open end of the tube. The opening has a second shape that is approximately the same as the first shape.