发明名称 BARREL PLATING EQUIPMENT AND BARREL PLATING METHOD
摘要 PROBLEM TO BE SOLVED: To provide barrel plating equipment which surely plates even a small object to be plated. SOLUTION: The barrel plating equipment is provided with: a plating liquid tank 16 for storing a plating liquid 17; a cylindrical barrel 11 storing the object to be plated at the inside and dipped into the plating liquid 17 stored in the plating liquid tank 16; supporting members 14, 15 for supporting the barrel 11 rotatably by fixed shafts 24, 25; suction pipes 20, 21 having front end parts 20a, 21a opened to the inside of the barrel 11, and also having rear end parts 20b, 21b outside the barrel 11; and pumps 22, 23 connected to the rear end parts 20b, 21b of the suction pipes 20, 21, sucking accumulated air 18, 19 retaining in the barrel 11 from the front end parts 20a, 21a of the suction pipes 20, 21 and exhausting the same to the outside of the barrel 11, thus a phenomenon in which the object to be plated floats on the accumulated air 18, 19 retaining in the barrel 11 is prevented. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005325405(A) 申请公布日期 2005.11.24
申请号 JP20040144135 申请日期 2004.05.13
申请人 MATSUSHITA ELECTRIC IND CO LTD;TAIYO MANUFACTURING CO LTD 发明人 URYU HIDEKAZU;NAKAYAMA SHOGO;OISHI KAZUO;FUKUI SADAAKI;FUJITA YOSHINORI;NAKAO TOSHIYUKI;USAMI DAISUKE;KITAMURA KOICHI
分类号 C25D17/16;(IPC1-7):C25D17/16 主分类号 C25D17/16
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