发明名称 HOT-MELT ADHESIVE COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a hot-melt adhesive which solves a wrong adhesive performance state caused for the production of a conventional hot-melt adhesive having inferior stringiness and has excellent in stringiness, heat resistance and cold resistance. SOLUTION: This hot-melt adhesive composition prepared by compounding 0.5 to 5 pts.wt. of polyethylene (D) with 100 pts.wt. of a composition comprising 15 to 40 wt.% of a wax (A), 25 to 50 wt.% of an ethylene-unsaturated ester copolymer (B) and 30 to 45 wt.% of a tackifying resin (C) is characterized in that the average melt flow rate (g/10 mn) of the ethylene-unsaturated ester copolymer (B) is≤360 g/10 min, and the average melt flow rate the polyethylene (B) is≤10 g/10 min. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005325222(A) 申请公布日期 2005.11.24
申请号 JP20040144447 申请日期 2004.05.14
申请人 TOYO INK MFG CO LTD;TOYO PETROLIGHT KK 发明人 HARA KENICHI
分类号 C09J123/08;C09J123/06;C09J131/04;C09J191/06;(IPC1-7):C09J123/08 主分类号 C09J123/08
代理机构 代理人
主权项
地址