| 发明名称 |
Leistungshalbleitermodul |
| 摘要 |
<p>The module consists of semiconductor chips (4) held under pressure applied by springs (7). The spring is bypassed by a conductor (8) connecting the main terminal (41) of the chips with a cover plate (3). Ceramic supports (10) limit the force applied to the chips</p> |
| 申请公布号 |
DE59912676(D1) |
申请公布日期 |
2005.11.24 |
| 申请号 |
DE1999512676 |
申请日期 |
1999.12.21 |
| 申请人 |
ABB SCHWEIZ AG, BADEN |
发明人 |
LANG, DR.;BUCHER, BENNO;FREY, DR. |
| 分类号 |
H01L25/07;H01L21/52;H01L23/48;H01L25/04;H01L25/18;(IPC1-7):H01L23/48 |
主分类号 |
H01L25/07 |
| 代理机构 |
|
代理人 |
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| 主权项 |
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| 地址 |
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