发明名称 |
Multilayer heat conductive three dimensional diffusion plate as for power light diodes and CPU has superconductive plate between soft flexible plate and glass fiber material |
摘要 |
<p>A multi-layer heat-conductive three-dimensional diffusion plate comprises at least one superconductive (F) or copper-platinum plate between a soft flexible material that can transmit electrical signals and a glass fiber material for signal transmission. A microporous conductive ceramic plate (G) with transparent holes is fixed to the superconductive plate.</p> |
申请公布号 |
DE202005007880(U1) |
申请公布日期 |
2005.11.24 |
申请号 |
DE20052007880U |
申请日期 |
2005.05.19 |
申请人 |
HUANG, SUNG-PO |
发明人 |
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分类号 |
F28D21/00;F28F13/14;G06F1/20;H01L23/373;H01L23/467;H05K7/20;(IPC1-7):F28F13/14 |
主分类号 |
F28D21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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