发明名称 Multilayer heat conductive three dimensional diffusion plate as for power light diodes and CPU has superconductive plate between soft flexible plate and glass fiber material
摘要 <p>A multi-layer heat-conductive three-dimensional diffusion plate comprises at least one superconductive (F) or copper-platinum plate between a soft flexible material that can transmit electrical signals and a glass fiber material for signal transmission. A microporous conductive ceramic plate (G) with transparent holes is fixed to the superconductive plate.</p>
申请公布号 DE202005007880(U1) 申请公布日期 2005.11.24
申请号 DE20052007880U 申请日期 2005.05.19
申请人 HUANG, SUNG-PO 发明人
分类号 F28D21/00;F28F13/14;G06F1/20;H01L23/373;H01L23/467;H05K7/20;(IPC1-7):F28F13/14 主分类号 F28D21/00
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