| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a package for a light emitting diode capable of reducing a mounting area onto a mounting substrate, and improving the take-out efficiency of light to outside while high in reliability; and to provide the manufacturing method of the light emitting device. <P>SOLUTION: The package 1 is constituted of a package body 1a and a protective member 1b. The package main body 1a is provided with a receiving recess 11 for receiving a light emitting diode chip A which is formed on one surface side of a silicon substrate 10, electrodes 15a, 15b for external connection formed on the other surface side of the substrate 10, chip connecting electrodes 13a, 13b on the inner bottom of the recess 11, and wirings 16a, 16b for connecting the chip connecting electrodes 13a, 13b to the externally connecting electrode 15a, 15b while penetrating the package body 1a. The protective member 1b is provided with transparency with respect to light irradiated from the light emitting diode chip A, and constituted of a glass substrate secured to the package body 1a so as to be air-tight in a form to close the receiving recess 11 in one surface side of the silicon substrate 10. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
