发明名称 |
CARBON-DOPED-Si OXIDE ETCH USING H2 ADDITIVE IN FLUOROCARBON ETCH CHEMISTRY |
摘要 |
Certain embodiments include an etching method (200 and 1600) including providing an etch material (210), applying a gas mixture including hydrogen (230) forming a plasma (240), and etching the etch material (250). The etch material can include a low-k dielectric material. The gas mixture can include a hydrogen gas, a hydrogen-free fluorocarbon, and a nitrogen gas, and further include one or more of a hydrofluorocarbon gas, an inert gas, and/or a carbon monoxide gas. The hydrogen gas can be a diatomic hydrogen, a hydrocarbon, a silane and/or a fluorine-free hydrogen gas, including H2, CH4, C2H4, NH3, and/or H20 gases. The hydrogen-free fluorocarbon gas can be a CXFY gas (where x>=1 and Y>=1) and the hydrofluorocarbon gas can be a CXHYFZ gas (where x>=1, y>=1 and z>=l). The gas mixture can be free of oxygen. Embodiments can include reduced pressures, reduced hydrogen flow rates and one or more plasma frequencies. |
申请公布号 |
WO2005112092(A2) |
申请公布日期 |
2005.11.24 |
申请号 |
WO2005US16355 |
申请日期 |
2005.05.09 |
申请人 |
APPLIED MATERIALS, INC.;GU, BINXI;DELGADINO, GERARDO;YE, YAN;CHEN, MIKE, MING, YU |
发明人 |
GU, BINXI;DELGADINO, GERARDO;YE, YAN;CHEN, MIKE, MING, YU |
分类号 |
B44C1/22;H01L21/027;H01L21/302;H01L21/311;H01L21/768 |
主分类号 |
B44C1/22 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|