| 发明名称 |
METHOD OF TIN PLATING, METHOD OF MANUFACTURING LEAD FRAME USING THAT METHOD OF TIN PLATING, LEAD FRAME MANUFACUTRED BY THAT METHOD, AND SEMICONDUCTOR PACKAGE INCLUDING THAT LEAD FRAME |
| 摘要 |
|
| 申请公布号 |
KR20050110168(A) |
申请公布日期 |
2005.11.23 |
| 申请号 |
KR20040035090 |
申请日期 |
2004.05.18 |
| 申请人 |
SAMSUNG TECHWIN CO., LTD. |
发明人 |
CHOI, WOO SUK;KIM, JUNG DO |
| 分类号 |
H01L23/495;(IPC1-7):H01L23/495 |
主分类号 |
H01L23/495 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
