发明名称 |
PACKAGED MICROCHIP WITH THERMAL STRESS RELIEF |
摘要 |
A packaged microchip has an isolator that minimizes stress transmission from its package to its microchip. To that end, the packaged microchip includes a stress sensitive microchip having a bottom surface with a bottom surface area, and a package having an integral isolator. The isolator has a top surface with a top surface area that is smaller than the bottom surface area of the microchip. The microchip bottom surface is coupled to the top surface of the isolator. |
申请公布号 |
EP1597761(A2) |
申请公布日期 |
2005.11.23 |
申请号 |
EP20040713380 |
申请日期 |
2004.02.20 |
申请人 |
ANALOG DEVICES, INC. |
发明人 |
LONG, LEWIS;HARNEY, KIERAN, P. |
分类号 |
G01P9/04;B81B;B81B3/00;B81B7/00;G01C19/56;G01P15/08;H01L21/58;H01L23/00;H01L23/08;H01L23/13;H01L23/16 |
主分类号 |
G01P9/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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