发明名称 APPLICABILITY IMPROVER FOR PHOTOSENSITIVE RESIN COMPOSITION AND PHOTOSENSITIVE RESIN COMPOSITION CONTAINING THE SAME
摘要 <p>To solve simultaneously the problems of scale-shaped unevenness (scale unevenness) and a raise (bead) in the edge of a substrate coming into existence upon application of a photosensitive resin composition onto particularly a large-size substrate, a silicone oil represented by the general formula (1) below is incorporated into a photosensitive resin composition containing an alkali-soluble resin such as novolak resin and a photosensitizer having a quinonediazide group in an amount of 50 to 5,000 ppm based on the total solids content of a photosensitive resin composition. &lt;CHEM&gt; wherein R1, R2, R3, R4, R5 and R6 independently represent a hydrogen atom, a hydroxyl group, a C1-4 alkyl group or an aryl group, m is an integer of 1 to 40, and n is an integer of 1 to 40.</p>
申请公布号 EP1598700(A1) 申请公布日期 2005.11.23
申请号 EP20030772776 申请日期 2003.11.14
申请人 AZ ELECTRONIC MATERIALS (JAPAN) K.K. 发明人 WATANABE, JUNICHIRO;TAKEDA, TAKASHI
分类号 G03F7/004;C08G77/04;G03F7/022;G03F7/023;G03F7/039;G03F7/075;H01L21/027;(IPC1-7):G03F7/004 主分类号 G03F7/004
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