发明名称 |
METHOD FOR PRODUCING CIRCUIT-FORMING BOARD AND MATERIAL FOR PRODUCING CIRCUIT-FORMING BOARD |
摘要 |
A hole formed in a material sheet is provided with a conductive portion. A metal foil is arranged on the surface of the material sheet, thereby obtaining a laminate sheet. A circuit-forming board is obtained by hot pressing the laminate sheet. The surface of the metal foil has a pressure absorbing portion whose thickness is changed by the applied pressure and a hard portion arranged adjacent to the pressure absorbing portion. By using this circuit-forming board, there can be obtained a high-density, excellent-quality circuit board having improved reliability in electrical connection. |
申请公布号 |
KR20050110001(A) |
申请公布日期 |
2005.11.22 |
申请号 |
KR20057017222 |
申请日期 |
2005.09.14 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
NISHII TOSHIHIRO |
分类号 |
H05K3/46;H05K3/38;H05K3/40;(IPC1-7):H05K3/46 |
主分类号 |
H05K3/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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